Copper for electronics
Copper for electronics in the news
Copper Rebounds in N.Y. as Equity Rally Boosts Economic Outlook (Bloomberg)
March 9 (Bloomberg) -- Copper prices recovered from earlier losses in New York as rallying equity markets boosted the outlook for the U.S. economy, the world’s largest.
Copper Declines for Second Day as Rising Dollar Curbs Demand (Bloomberg)
March 9 (Bloomberg) -- Copper prices fell for a second day as a rising dollar curbed demand for industrial metals as an alternative investment. The U.S. Dollar Index, a six-currency gauge of the greenback’s strength, rose as much as 0.5 percent.
Leadframe maker SDI signs cooperation agreement with Mitsubishi Shindoh (Digi Times)
Leadframe maker Shuen Der Industry (SDI) has signed a technology cooperation agreement with Japan-based Mitsubishi Shindoh on March 10 for the production of copper strips for leadframes. Under the agreement, SDI will pay royalties to Mitsubishi Shindoh for the delivery of its production equipment and related technologies. Meanwhile, the Japan-based company will also take up shares in SDI through ...
Copper Imports by China May Fall 16%, Analyst Says (Update1) (Bloomberg)
March 9 (Bloomberg) -- China’s net imports of refined copper may fall 16 percent this year as manufacturers run down stockpiles and domestic production increases, an analyst at Shanghai Nonferrous Metals, said.
Universal Resources Limited (ASX:URL) Updates On Land Purchase And Outokumpu Copper Project (MENAFN)
Universal Resources Limited (ASX:URL) Updates On Land Purchase And Outokumpu Copper Project
Novellus Develops Advanced Copper Seed Technology for Through-Silicon-Via (TSV) Packaging (redOrbit)
SAN JOSE, Calif., March 8 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq: NVLS) today announced that it has developed a new, advanced copper barrier-seed physical vapor deposition (PVD) process for the emerging through-silicon-via (TSV) packaging market.
Novellus Develops Advanced Copper Seed Technology for Through-Silicon-Via (TSV) Packaging (PR Newswire via Yahoo! Finance)
Novellus Systems today announced that it has developed a new, advanced copper barrier-seed physical vapor deposition process for the emerging through-silicon-via packaging market. The process uses Novellus' production-proven INOVA® platform with patented Hollow Cathode Magnetron technology to produce highly-conformal copper seed films that are four times thinner than the conventional PVD seed ...
Asian Stocks Rise on Outlook for Japanese Economy; BHP Declines (Bloomberg)
March 11 (Bloomberg) -- Asian stocks rose, sending the MSCI Asia Pacific Index toward a seven-week high, as speculation Japan’s economy is recovering outweighed concern China will pare back measures that spurred growth.
Tweed pitches in to save landfill (The Community Press)
Tweed – An eye-popping assortment of electronics filled the trailers at the Electronics Waste Drop-off held at the Tweed Firehall last Saturday between 10 a.m. and 3 p.m. Much of the electronics waste was old computers and peripherals with a goodly number of ancient television sets.[...]
US-TECH Summary (Reuters via Yahoo! Singapore News)
Digital mirror: fashion brands convey glamour online
